2560-600 PI Gold Finger Tape: Ultra-High Temperature Protection Expert with 600g Peel Strength

Product Overview
2560-600 PI Gold Finger Tape is a high-performance polyimide tape specifically designed for extreme high-temperature and high peel strength requirements. Made with premium PI (polyimide) film and silicone adhesive, it features excellent heat resistance, superior electrical insulation properties, and ultra-high adhesion strength, making it an ideal choice for PCB gold finger protection, wave soldering masking, and other demanding high-temperature applications.
Key Advantages
1. Ultra-High Temperature Resistance
Withstands temperatures up to 260℃. After 30 minutes at 260℃, the tape shows no shrinkage, no deformation, and no adhesive residue upon removal, with stable and reliable performance, suitable for more demanding high-temperature process environments.
2. Ultra-High Peel Strength
Steel plate peel strength reaches 600±120g/25mm, providing higher adhesion strength compared to 2550 PI (550g/25mm), ensuring extremely strong adhesion even in high-temperature and high-humidity environments, no edge lifting or falling off.
3. Excellent Electrical Insulation
Voltage resistance reaches 5KV, providing good electrical insulation properties, suitable for insulation protection of electronic components, ensuring safe and reliable circuit operation.
4. Outstanding Mechanical Strength
Tensile strength reaches 135N/25mm, with excellent tensile resistance and dimensional stability, not easy to break in high-speed automated production.
5. Good Holding Power
Holding power ≥72 hours, initial tack ≥22# steel ball, ensuring stable adhesion effect even in long-term high-temperature environments.
6. Precision Thickness Control
Total product thickness 0.06±0.004mm, with PI film thickness of 0.025±0.002mm and silicone adhesive layer of 0.035±0.002mm. Precision thickness control ensures product performance consistency and stability.
Application Fields
- PCB Gold Finger Protection: Protects gold fingers from oxidation, contamination, or damage during wave soldering, reflow soldering, and other high-temperature processes
- Wave Soldering Masking: Used for local masking of PCB boards to prevent solder contamination of non-welding areas
- Reflow Soldering Protection: Protects sensitive components and areas during high-temperature reflow soldering
- Electronic Component Fixing: Used for temporary fixation of electronic components during SMT processes, does not fall off at high temperatures
- Coil Winding Insulation: Used for winding insulation protection of motors and transformer coils
- Transformer Insulation: Provides reliable electrical insulation protection, voltage resistance 5KV
- Other High-Temperature Insulation: Widely used in electronics, electrical appliances, telecommunications, automotive, aerospace, and other industries
Technical Specifications
| Item | Specification | Test Standard |
|---|---|---|
| Film Material | PI (Polyimide) | - |
| Film Thickness | 0.025±0.002mm | GB/T 125-1999 |
| Adhesive Thickness | 0.035±0.002mm | GB/T 125-1999 |
| Total Thickness | 0.06±0.004mm | GB/T 125-1999 |
| Initial Tack | ≥22# (Steel Ball) | GB/T 4852 |
| Holding Power | ≥72h | GB/T 4851-1998 |
| Steel Plate Peel Strength | 600±120g/25mm | GB/T 2792-1998 |
| Tensile Strength | 135N/25mm | GB/T 30776 |
| Voltage Resistance | 5KV | - |
| Temperature Resistance | 260℃/0.5h | Enterprise Standard |
Usage Instructions
- Surface Cleaning: Ensure the surface to be adhered is clean, dry, and free of oil, grease, and dust before use. Wipe with alcohol or specialized cleaner
- Pressure Application: Apply appropriate pressure during adhesion to ensure full contact between the tape and the surface, improving adhesion effect
- Test Verification: Small-scale testing is recommended before large-area application to confirm product suitability and process parameters
- Storage Conditions: Store in an environment at 5-35℃ with relative humidity below 70%, avoid direct sunlight
- Shelf Life: Best performance within 180 days from production date. Retest expired products before use
- Test Environment: Standard test conditions are temperature 23±2℃, relative humidity 60±5%
Packaging Specifications
Standard packaging: 10mm/20mm/30mm/50mm width × 33m length/roll. Custom slitting specifications available according to customer requirements, providing personalized size solutions to meet the needs of different application scenarios.
Why Choose 2560-600?
With its excellent heat resistance (260℃), ultra-high peel strength (600g/25mm), superior electrical insulation (5KV), and outstanding mechanical strength (135N/25mm), 2560-600 PI Gold Finger Tape has become the preferred high-temperature masking and insulation material for high-end electronics manufacturers. Whether for PCB manufacturing, SMT processing, transformer insulation, or coil winding, 2560-600 provides professional and reliable solutions.
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